CY7C1518KV18-333BZXC | Cypress Semiconductor

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CY7C1518KV18-333BZXC
Status: In Production

Datasheet

(pdf, 790.33 KB) RoHS PB Free
(pdf, 1.42 MB) RoHS PB Free

CY7C1518KV18-333BZXC

ArchitectureDDR-II CIO
Automotive QualifiedN
Burst Length (Words)2
Density (Kb)73728
Density (Mb)72
Frequency (MHz)333
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)4Mb x 18
Part FamilyDDR-II CIO
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$173.57 $146.79 $141.83 $135.88 $131.91 $127.94
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (5)

Product Change Notice (PCN) (9)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of 65nm products without Nitride Seal Mask (NSM)
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Oct 18, 2017
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Oct 11, 2017
Oct 10, 2017
PCN154102 - Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

IBIS (1)

Mar 15, 2011

Verilog (1)

Nov 22, 2010

BSDL (1)

Nov 16, 2010