CY7C1513KV18-333BZXC | Cypress Semiconductor
CY7C1513KV18-333BZXC
| Architecture | QDR-II |
| Automotive Qualified | N |
| Burst Length (Words) | 4 |
| Density (Kb) | 73728 |
| Density (Mb) | 72 |
| Frequency (MHz) | 333 |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 1.90 |
| Max. Operating Voltage (V) | 1.90 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 1.40 |
| Min. Operating Voltage (V) | 1.70 |
| Organization (X x Y) | 4Mb x 18 |
| Part Family | QDR-II |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $173.57 | $146.79 | $141.83 | $135.88 | $131.91 | $127.94 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
5
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Package Material Declaration
Last Update: Nov 09, 2016
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Sep 15, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Product Change Notice (PCN) (8)
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Feb 07, 2016
Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products