CY7C1512KV18-333BZXI | Cypress Semiconductor

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CY7C1512KV18-333BZXI
Status: In Production

Datasheet

(pdf, 938.37 KB) RoHS PB Free
(pdf, 1000.53 KB) RoHS PB Free

CY7C1512KV18-333BZXI

ArchitectureQDR-II
Automotive QualifiedN
Burst Length (Words)2
Density (Kb)73728
Density (Mb)72
Frequency (MHz)333
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)4Mb x 18
Part FamilyQDR-II
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$173.57 $146.79 $141.83 $135.88 $131.91 $127.94
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (5)

Product Change Notice (PCN) (9)

Oct 18, 2017
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Oct 11, 2017
Oct 10, 2017
PCN154102 - Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products
Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 08, 2016
Qualification of 65nm products without Nitride Seal Mask (NSM)
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Verilog (1)

Mar 15, 2011

IBIS (1)

Dec 09, 2010

BSDL (1)

Nov 16, 2010