CY7C1480V33-167AXC | Cypress Semiconductor

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CY7C1480V33-167AXC
Status: In Production

Datasheet

(pdf, 382.31 KB) RoHS PB Free

CY7C1480V33-167AXC

ArchitectureStandard Sync, Pipeline SCD
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)73728
Density (Mb)72
Frequency (MHz)167
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)2Mb x 36
Part FamilyStandard Sync
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$156.80 $132.61 $128.13 $122.75 $119.17 $115.58
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
72
Minimum Order Quantity (MOQ)
72
Order Increment
72
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Sep 04, 2017

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (13)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 16, 2017
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 15, 2017
Change of die thickness from 11 mils to 7 mils for R9 72M (Large Die) assembled in TQFP 100 leads, 14 x 20 x 1.4 mm package
Oct 13, 2017
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (4)

Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

IBIS (2)

Nov 22, 2010
Nov 22, 2010

BSDL (2)

Jan 05, 2010
Jan 05, 2010

Verilog (2)

Nov 13, 2008

VHDL (2)

Nov 13, 2008
Nov 13, 2008