CY7C1470V33-167BZI | Cypress Semiconductor

You are here

CY7C1470V33-167BZI
Status: In Production

Datasheet

(pdf, 739.63 KB)

CY7C1470V33-167BZI

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)73728
Density (Mb)72
Frequency (MHz)167
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)2Mb x 36
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$172.20 $145.63 $140.71 $134.81 $130.87 $126.94
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 104 24-48 hours

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
629.20 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (8)

May 28, 2018
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
May 27, 2018
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
May 27, 2018
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
May 27, 2018
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
May 27, 2018
Shipping Label Upgrade
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Verilog (1)

Mar 18, 2015

IBIS (1)

Nov 22, 2010

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008