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CY7C1470V25-200BZI | Cypress Semiconductor

CY7C1470V25-200BZI

Status: In Production

CY7C1470V25-200BZI

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)73728
Density (Mb)72
Frequency (MHz)200
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)2.60
Max. Operating Voltage (V)2.63
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)2.38
Organization (X x Y)2Mb x 36
Part FamilyNoBL
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$204.67 $179.09 $175.25 $171.41 $167.58 $163.74
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
629.20 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
49
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Apr 15, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (8)

Feb 10, 2016
72M Synchronous SRAM design change to fix ZZ pin erratum and enhance internal test modes
Feb 10, 2016
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Feb 10, 2016
Shipping Label Upgrade
Feb 09, 2016
72Mb Synchronous SRAM CY7C14xx Family Revision B now released to full production
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Verilog (1)

Mar 17, 2015

IBIS (1)

Mar 15, 2011

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008