CY7C1470BV25-200BZXI | Cypress Semiconductor

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CY7C1470BV25-200BZXI
Status: In Production

Datasheet

(pdf, 924.78 KB) RoHS PB Free

CY7C1470BV25-200BZXI

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)73728
Density (Mb)72
Frequency (MHz)200
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)2.60
Max. Operating Voltage (V)2.63
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)2.38
Organization (X x Y)2Mb x 36
Part FamilyNoBL
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$173.60 $146.82 $141.86 $135.90 $131.94 $127.97
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
645.61 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
63
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (4)

Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Verilog (1)

Aug 18, 2014

IBIS (1)

Aug 18, 2014

BSDL (1)

Mar 26, 2013