CY7C1420AV18-200BZC | Cypress Semiconductor

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CY7C1420AV18-200BZC
Status: Obsolete

CY7C1420AV18-200BZC

ArchitectureDDR-II CIO
Automotive QualifiedN
Burst Length (Words)2
Density (Kb)36864
Density (Mb)36
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)1Mb x 36
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$53.67 $47.87 $44.39 $40.90 $39.45 $37.71
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
669 L x 1.4 H x 590 W (Mils)
Package Weight
629.20 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
105
Minimum Order Quantity (MOQ)
105
Order Increment
105
Estimated Lead Time (days)
77
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Aug 29, 2017

Technical Documents

Application Notes (5)

Product Change Notice (PCN) (5)

Oct 18, 2017
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Oct 13, 2017
Datasheet Changes to 18Mb/36Mb/72Mb Burst of 2/4 QDR-I/DDR-I/QDR-II/DDR-II Products

Product Errata Notice (PEN) (1)

Oct 30, 2017
Product Errata Notification - RAM9 QDR-I/DDR-I/QDR-II/DDR-II Errata

IBIS (1)

Nov 19, 2010

VHDL (1)

Jan 05, 2010

BSDL (1)

Nov 13, 2008

Verilog (1)

Nov 13, 2008