CY7C1370DV25-200BZCT | Cypress Semiconductor

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CY7C1370DV25-200BZCT
Status: Obsolete

CY7C1370DV25-200BZCT

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)18432
Density (Mb)18
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)2.60
Max. Operating Voltage (V)2.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)2.38
Organization (X x Y)512Kb x 36
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$35.76 $31.89 $29.57 $27.26 $26.29 $25.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (8)

Oct 16, 2017
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
Oct 13, 2017
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Oct 12, 2017
Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

Verilog (2)

Nov 22, 2010
Nov 22, 2010

IBIS (2)

Nov 22, 2010
Nov 22, 2010

VHDL (2)

Nov 13, 2008
Nov 13, 2008

BSDL (2)

Nov 13, 2008
Nov 13, 2008