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CY7C1370D-200BZC | Cypress Semiconductor

CY7C1370D-200BZC

Status: Obsolete

CY7C1370D-200BZC

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)18432
Density (Mb)18
Frequency (MHz)200
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)512Kb x 36
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$35.67 $31.81 $29.50 $27.18 $26.22 $25.06
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (8)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Feb 10, 2016
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Feb 10, 2016
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Termination Notice (PTN) (1)

Feb 04, 2016
December 2012 Product Obsolescence Notification

Verilog (1)

Nov 22, 2010

IBIS (1)

Nov 22, 2010

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008