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CY7C1360C-166BZC | Cypress Semiconductor


Status: In Production


(pdf, 1.18 MB)
Datasheet updated: October 22, 2015


ArchitectureStandard Sync, Pipeline SCD
Burst Length (Words)0
Density (Kb)9216
Density (Mb)9
Frequency (MHz)166
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)256Kb x 36
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.93 $12.42 $11.52 $10.62 $10.24 $9.79
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (11)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Feb 10, 2016
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Feb 10, 2016
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Feb 10, 2016
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Verilog (1)

Jan 19, 2012

IBIS (1)

Jan 18, 2012

BSDL (1)

Jan 18, 2012

VHDL (1)

Nov 13, 2008