CY7C1357C-100BZC | Cypress Semiconductor

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CY7C1357C-100BZC
Status: In Production

Datasheet

(pdf, 2.93 MB)

CY7C1357C-100BZC

ArchitectureNoBL, Flow-through
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)9216
Density (Mb)9
Frequency (MHz)100
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)512Kb x 18
Part FamilyNoBL
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.93 $12.42 $11.52 $10.62 $10.24 $9.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (11)

Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
Oct 13, 2017
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Oct 13, 2017
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

IBIS (1)

Nov 22, 2010

Verilog (1)

Nov 18, 2010

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008