CY7C1355C-133BGCT | Cypress Semiconductor

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CY7C1355C-133BGCT
Status: Obsolete

CY7C1355C-133BGCT

ArchitectureNoBL, Flow-through
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)9216
Density (Mb)9
Frequency (MHz)133
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)256Kb x 36
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.02 $12.51 $11.60 $10.69 $10.31 $9.85
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
500
Minimum Order Quantity (MOQ)
500
Order Increment
500
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Dec 14, 2016

Technical Documents

Application Notes (3)

Product Change Notice (PCN) (4)

Oct 20, 2017
Qualification of Green Mold Compound for select packages at ASE Taiwan
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Oct 12, 2017
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem

Product Termination Notice (PTN) (2)

Oct 30, 2017
Correction to May 2011 Product Obsolescence Notification
Oct 30, 2017
May 2011 Product Obsolescence Notification

IBIS (1)

Nov 22, 2010

Verilog (1)

Nov 18, 2010

BSDL (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008