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CY7C1354C-166BGC | Cypress Semiconductor

CY7C1354C-166BGC

Status: Obsolete

CY7C1354C-166BGC

ArchitectureNoBL, Pipeline
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)9216
Density (Mb)9
Frequency (MHz)166
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)256Kb x 36
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.93 $12.42 $11.52 $10.62 $10.24 $9.79
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
84
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Dec 17, 2015

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (5)

Feb 10, 2016
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
Feb 10, 2016
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Green Mold Compound for select packages at ASE Taiwan

Product Termination Notice (PTN) (1)

Feb 04, 2016
December 2012 Product Obsolescence Notification

Verilog (1)

Nov 18, 2010

BSDL (1)

Nov 13, 2008

IBIS (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008