CY7C1347G-200AXCT | Cypress Semiconductor
CY7C1347G-200AXCT
| Architecture | Standard Sync, Pipeline SCD |
| Automotive Qualified | N |
| Burst Length (Words) | 0 |
| Density (Kb) | 4096 |
| Density (Mb) | 4 |
| Frequency (MHz) | 200 |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.63 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating VCCQ (V) | 2.40 |
| Min. Operating Voltage (V) | 3.14 |
| Organization (X x Y) | 128Kb x 36 |
| Part Family | Standard Sync |
| Tape & Reel | Y |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.05 | $6.29 | $5.83 | $5.37 | $5.18 | $4.95 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
750
Minimum Order Quantity (MOQ)
750
Order Increment
750
Estimated Lead Time (days)
35
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Package Material Declaration
Last Update: Dec 22, 2015
IPC 1752 Material Declaration
Last Update: Nov 10, 2016
Last Update: Nov 10, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Technical Documents
Product Change Notice (PCN) (10)
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Product Information Notice (PIN) (5)
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products