CY7C1347G-133BGXC | Cypress Semiconductor

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CY7C1347G-133BGXC
Status: Obsolete

Datasheet

(pdf, 2.11 MB) RoHS PB Free

CY7C1347G-133BGXC

ArchitectureStandard Sync, Pipeline SCD
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)4096
Density (Mb)4
Frequency (MHz)133
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)128Kb x 36
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$8.07 $7.19 $6.67 $6.15 $5.93 $5.67
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
985.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
84
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (3)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 119 ball 14x22x2.4mm BGA Packages Using SnAgCu Solder Balls
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Dec 22, 2015
Jan 2016 Product Obsolescence Notification

Verilog (1)

Jun 22, 2011

IBIS (1)

Jun 22, 2011