CY7C1338G-100AXCT | Cypress Semiconductor

CY7C1338G-100AXCT

Status: In Production

Datasheet

(pdf, 2.05 MB) RoHS PB Free
Datasheet updated: November 21, 2016

CY7C1338G-100AXCT

ArchitectureStandard Sync, Flow-through
Automotive QualifiedN
Burst Length (Words)0
Density (Kb)4096
Density (Mb)4
Frequency (MHz)100
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)2.40
Min. Operating Voltage (V)3.14
Organization (X x Y)128Kb x 32
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.05 $6.29 $5.83 $5.37 $5.18 $4.95
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
750
Minimum Order Quantity (MOQ)
750
Order Increment
750
Estimated Lead Time (days)
35
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Dec 22, 2015

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (10)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

Verilog (1)

Nov 18, 2010

IBIS (1)

Nov 18, 2010

VHDL (1)

Nov 13, 2008