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CY7C1320CV18-267BZXC | Cypress Semiconductor

CY7C1320CV18-267BZXC

Status: Obsolete

CY7C1320CV18-267BZXC

ArchitectureDDR-II CIO
Automotive QualifiedN
Burst Length (Words)2
Density (Kb)18432
Density (Mb)18
Frequency (MHz)267
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)512Kb x 36
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$35.91 $32.03 $29.70 $27.37 $26.40 $25.23
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
165
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
136
Minimum Order Quantity (MOQ)
136
Order Increment
136
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

IPC 1752 Material Declaration

Technical Documents

Product Change Notice (PCN) (3)

Feb 10, 2016
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Release of 18M QDRII/DDRII/QDRII+/DDRII+ (Phase II) Synchronous SRAM Products in 65nm Technology

Product Errata Notice (PEN) (1)

Feb 04, 2016
Product Errata Notification - RAM9 QDR-I/DDR-I/QDR-II/DDR-II Errata

Verilog (1)

Nov 19, 2010

IBIS (1)

Nov 19, 2010

BSDL (1)

Nov 13, 2008