CY7C1303BV25-167BZC | Cypress Semiconductor

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Status: In Production


(pdf, 2.15 MB)


Automotive QualifiedN
Burst Length (Words)2
Density (Kb)18432
Density (Mb)18
Frequency (MHz)167
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)2.63
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)2.38
Organization (X x Y)1Mb x 18
Part FamilyQDR
Part FamilyQDR
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$28.32 $25.26 $23.42 $21.59 $20.82 $19.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
501.06 (mgs)
Package Cross Section Drawing
Package Carrier
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

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Technical Documents

Product Change Notice (PCN) (12)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Feb 10, 2016
Subject: Qualification of 165 ball 13x15x1.4mm BGA Pb-Free and SnPb Solder Ball Packages
Feb 10, 2016
Change of assembly materials for all FBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Feb 10, 2016
Qualification of Cypress Manufacturing Limited as an additional assembly site for 165-FBGA. This supersedes the Advanced PCN No. 060981
Feb 10, 2016
Change of BGA165 tray from 126 units per tray to 119 units per tray
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Product Errata Notice (PEN) (1)

Feb 04, 2016
Product Errata Notification - RAM9 QDR-I/DDR-I/QDR-II/DDR-II Errata

Verilog (1)

Nov 13, 2008

VHDL (1)

Nov 13, 2008

BSDL (1)

Nov 13, 2008

IBIS (1)

Nov 13, 2008