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CY7C1069DV33-10BVXIT | Cypress Semiconductor


Status: Obsolete


(pdf, 1.36 MB) RoHS PB Free
Datasheet updated: July 18, 2016


Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)2M x 8
Speed (ns)10
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$45.70 $37.28 $35.11 $32.95 $31.99 $30.78
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
118.27 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (7)

Feb 10, 2016
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 8x9.5mm BGA Packages Using SnAgCu Solder Balls
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Qualification of Cypress Philippines as an additional Assembly Site for select 48-Ball, BGA, 8X9.5X1.0mm, Pb-Free Package
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Qualification of Polyimide Process for 90nm 16M density SRAM products
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

White Papers (1)

PCN (1)

Sep 30, 2015
16Mb FAST Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology

IBIS (1)

Sep 15, 2009

VHDL (1)

Sep 15, 2009