CY7C1062AV33-10BGIT | Cypress Semiconductor

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CY7C1062AV33-10BGIT
Status: Obsolete

CY7C1062AV33-10BGIT

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)512K x 32
Speed (ns)10
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$40.85 $33.33 $31.39 $29.46 $28.60 $27.52
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
500
Minimum Order Quantity (MOQ)
500
Order Increment
500
Estimated Lead Time (days)
42
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Dec 14, 2016

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (4)

Oct 18, 2017
Q4, 2008 - Q4, 2009 Horizon Report
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Oct 12, 2017
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem

Product Information Notice (PIN) (2)

Oct 25, 2017
Q3, 2009 - Q4, 2010 Horizon Report
Apr 22, 2010
Q4, 2009 - Q1, 2011 Horizon Report

VHDL (1)

Sep 15, 2009

IBIS (1)