CY7C1051DV33-10BAXI | Cypress Semiconductor

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CY7C1051DV33-10BAXI
Status: In Production

Datasheet

(pdf, 553.33 KB) RoHS PB Free

CY7C1051DV33-10BAXI

Development KitN/A
Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)512K x 16
Part FamilyAsync Fast SRAMs
Speed (ns)10
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$51.76 $42.22 $39.84 $37.46 $36.77 $35.75
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 60 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
315 L x 1.2 H x 236 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
84
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

RoHS Analysis Certificates (CoA) for Direct Materials

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Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 16, 2016

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (3)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
Feb 05, 2016
Qualification of New Tray and Tape & Reel Material
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages

White Papers (1)

VHDL (1)

Sep 15, 2009

IBIS (1)

Sep 15, 2009