CY7C1049BNL-17VC | Cypress Semiconductor

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CY7C1049BNL-17VC
Status: Obsolete

Datasheet

(pdf, 443.99 KB)

CY7C1049BNL-17VC

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)512K x 8
Speed (ns)17
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
70
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
95
Minimum Order Quantity (MOQ)
95
Order Increment
95
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (11)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend) package and 44 pin TSOP II (Thin Shrunk Outline Package)
Feb 08, 2016
Correction to PCN 061134 4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend)package and 44 pin TSOP II (Thin Shrunk Outline Package)
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Dec 22, 2015
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Apr 09, 2012

IBIS (1)

Sep 15, 2009