CY7C1041CV33-10ZSXAT | Cypress Semiconductor

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Status: NRND: Recommended CY7C1041G30-10ZSXAT


(pdf, 644.74 KB) RoHS PB Free


Development KitN/A
Automotive QualifiedY
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)256K x 16
Speed (ns)10
Tape & ReelY
Temp. ClassificationAutomotive(A)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$9.24 $7.77 $6.93 $6.09 $5.75 $5.38
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (5)

Feb 06, 2017
Addendum to PCN162401: 4Mb / 2Mb FAST and 4Mb Micropower (MoBL®) Automotive Asynchronous SRAM Products: Technology Transition to 65-nanometer Technology
Aug 03, 2016
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 08, 2016
Qualification of Chipmos,Taiwan as an additional Burn In site for 44 pin TSOP II Package for selected automotive grade SRAMs
Feb 08, 2016
Qualification of New Lead frame for 44-Lead TSOP II Automotive Products.

Product Information Notice (PIN) (5)

Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Feb 05, 2016
Qualification of ChipMOS Taiwan as an additional Burn-In, Test and Finish site for select automotive grade products in 44-pin TSOP II and 100-pin TQFP packages
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

White Papers (1)

VHDL (1)

Sep 15, 2009

IBIS (1)

Sep 15, 2009