CY7C1041BNV33L-12ZXCT | Cypress Semiconductor

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CY7C1041BNV33L-12ZXCT
Status: Obsolete

Datasheet

(pdf, 514.33 KB) RoHS PB Free

CY7C1041BNV33L-12ZXCT

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)256K x 16
Speed (ns)12
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.41 $12.12 $10.81 $9.50 $8.97 $8.38
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (14)

Oct 31, 2017
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 23, 2017
4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend) package and 44 pin TSOP II (Thin Shrunk Outline Package)
Oct 23, 2017
Correction to PCN 061134 4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend)package and 44 pin TSOP II (Thin Shrunk Outline Package)
Oct 16, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (4)

Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

White Papers (1)

IBIS (1)

Sep 15, 2009

VHDL (1)

Sep 15, 2009