CY7C1041BNL-20VXCT | Cypress Semiconductor

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CY7C1041BNL-20VXCT
Status: Obsolete

CY7C1041BNL-20VXCT

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)256K x 16
Speed (ns)20
Tape & ReelY
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.71 $14.89 $13.28 $11.67 $11.03 $10.30
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOJ
No. of Pins
44
Package Dimensions
1 125 L x 0 H x 400 W (Mils)
Package Weight
1 785.53 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
500
Minimum Order Quantity (MOQ)
500
Order Increment
500
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (4)

Oct 23, 2017
4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend) package and 44 pin TSOP II (Thin Shrunk Outline Package)
Oct 23, 2017
Correction to PCN 061134 4M Fast Asynchronous SRAM Process Technology Transition from R52FD-5R (0.25 micron) to C9FD-3R (90-nanometer) including Lead-Free(RoHS Compliant) Package Conversion on 32/36/44 Pin SOJ (Small Outline J-Bend)package and 44 pin TSOP II (Thin Shrunk Outline Package)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (1)

Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (1)

Feb 05, 2016
May 2010 Product Obsolescence Notification