CY7C1021DV33-10BVXI | Cypress Semiconductor

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CY7C1021DV33-10BVXI
Status: In Production

Datasheet

(pdf, 394.53 KB) RoHS PB Free

CY7C1021DV33-10BVXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Speed (ns)10
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.08 $4.27 $3.81 $3.35 $3.16 $2.96
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 260 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
35
HTS Code
8542.32.0040
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (6)

Feb 10, 2016
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 15, 2009

IBIS (1)

Sep 15, 2009