CY7C1021D-10ZSXI | Cypress Semiconductor

CY7C1021D-10ZSXI

Status: In Production

Datasheet

(pdf, 1.58 MB) RoHS PB Free
Datasheet updated: June 05, 2016

CY7C1021D-10ZSXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)64K x 16
Speed (ns)10
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.16 $3.50 $3.12 $2.74 $2.59 $2.42
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
405
Minimum Order Quantity (MOQ)
405
Order Increment
405
Estimated Lead Time (days)
28
HTS Code
8542.32.0040
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (9)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Qualification of an Alternative Tray for 44-Lead TSOP II Product Shipments
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Qualification of Polyimide Process for 90nm 1M, 2M, 4M and 8M density SRAM products.
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 15, 2009

IBIS (1)

Sep 15, 2009