CY7C1021CV33-10VXC | Cypress Semiconductor

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CY7C1021CV33-10VXC
Status: Obsolete

CY7C1021CV33-10VXC

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Speed (ns)10
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOJ
No. of Pins
44
Package Dimensions
1 125 L x 0 H x 400 W (Mils)
Package Weight
1 785.53 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
255
Minimum Order Quantity (MOQ)
255
Order Increment
255
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (5)

Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 13, 2017
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (3)

Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Aug 12, 2008
Extension of Last Time Order Entry and Last Time Ship Dates for selected affected Fast Asynchronous SRAM parts, from previously sent Process Technology Change Notifications.

IBIS (1)

Sep 24, 2009

VHDL (1)