CY7C1021CV33-10BAXI | Cypress Semiconductor

You are here

CY7C1021CV33-10BAXI
Status: Obsolete

CY7C1021CV33-10BAXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Speed (ns)10
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
275 L x 1.2 H x 275 W (Mils)
Package Weight
103.15 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
416
Minimum Order Quantity (MOQ)
416
Order Increment
416
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

Last Update: Sep 01, 2017

IPC 1752 Material Declaration

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (4)

Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Oct 13, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 7X7X1.2mm BGA Packages Using SnAgCu Solder Balls

White Papers (1)

IBIS (1)

Sep 24, 2009

VHDL (1)