CY7C1021CV26-15ZSXE | Cypress Semiconductor

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CY7C1021CV26-15ZSXE
Status: In Production

Datasheet

(pdf, 600.59 KB) RoHS PB Free

CY7C1021CV26-15ZSXE

Development KitN/A
Automotive QualifiedY
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)125
Max. Operating VCCQ (V)2.70
Max. Operating Voltage (V)2.70
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.50
Min. Operating Voltage (V)2.50
Organization (X x Y)64K x 16
Speed (ns)15
Tape & ReelN
Temp. ClassificationAutomotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.94 $5.00 $4.46 $3.92 $3.70 $3.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
270
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (6)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Chipmos,Taiwan as an additional Burn In site for 44 pin TSOP II Package for selected automotive grade SRAMs
Feb 08, 2016
Qualification of Chipmos, Taiwan as an additional Test site for 44 pin TSOP II Package for selected automotive grade SRAMs
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.

Product Information Notice (PIN) (4)

Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Feb 05, 2016
Qualification of ChipMOS Taiwan as an additional Burn-In, Test and Finish site for select automotive grade products in 44-pin TSOP II and 100-pin TQFP packages
Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 15, 2009