CY7C1021BNV33L-15BAI | Cypress Semiconductor

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CY7C1021BNV33L-15BAI
Status: In Production

Datasheet

(pdf, 489.25 KB)

CY7C1021BNV33L-15BAI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64K x 16
Part FamilyAsync Fast SRAMs
Speed (ns)15
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.81 $3.20 $2.85 $2.51 $2.37 $2.21
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
48
Package Dimensions
275 L x 1.2 H x 275 W (Mils)
Package Weight
86.59 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
416
Minimum Order Quantity (MOQ)
416
Order Increment
416
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (6)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 20, 2017
Qualification of Green Mold Compound for select packages at ASE Taiwan
Oct 15, 2017
Change of Assembly Mold Compound Material for All FBGA packages built in Cypress Manufacturing Limited (CML) - Philippines

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Apr 02, 2012

IBIS (1)