CY7C1012AV33-8BGC | Cypress Semiconductor

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CY7C1012AV33-8BGC
Status: In Production

Datasheet

(pdf, 470.55 KB)

CY7C1012AV33-8BGC

Automotive QualifiedN
Density (Kb)12288
Frequency (MHz)N/A
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)512K x 24
Part FamilyAsync Fast SRAMs
Speed (ns)8
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$41.90 $34.18 $32.19 $30.21 $29.33 $28.22
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
119
Package Dimensions
866 L x 2.4 H x 551 W (Mils)
Package Weight
950.94 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
84
Minimum Order Quantity (MOQ)
84
Order Increment
84
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Package Material Declaration

Last Update: Dec 14, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (4)

Feb 10, 2016
Qualification of 119 ball 14x22x2.4mm BGA SnPb Solder Ball Packages Assembled at Unisem
Feb 10, 2016
Change of assembly materials for all PBGA packages built in Advance Semiconductor Engineering (ASE) -Taiwan.
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Green Mold Compound for select packages at ASE Taiwan

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

IBIS (1)