CY7C09289V-9AI | Cypress Semiconductor

CY7C09289V-9AI
Status: Obsolete

CY7C09289V-9AI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)3.00
Min. Operating Voltage (V)3.00
Organization (X x Y)64Kb x 16
Speed (ns)9
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$82.58 $70.07 $68.57 $66.57 $65.57 $64.06
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
161
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Ni/Pd/Au, Sn/Pb

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (7)

Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Change of assembly materials for all TQFP packages built in Advance Semiconductor Engg (ASE)-Taiwan
Feb 10, 2016
Add Palladium-Nickel-Gold Lead Finish to SOIC, QSOP, SNC, TQFP, TSOPI, TSOP II, TSSOP and SSOP Packages manufactured at CML.

Product Information Notice (PIN) (2)

Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (2)

Oct 30, 2017
October 2011 Product Obsolescence Notification
Feb 05, 2016
Second Errata for Prune/EOL/Obsolete PCN 071503

IBIS (1)

May 17, 2011