CY7C028V-20AI | Cypress Semiconductor
CY7C028V-20AI
Status: NRND: Contact Sales
Datasheet
(pdf, 571.96 KB)
CY7C028V-20AI
| Automotive Qualified | N |
| Density (Kb) | 1024 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 3.00 |
| Min. Operating Voltage (V) | 3.00 |
| Organization (X x Y) | 64Kb x 16 |
| Part Family | Stand. Async Dual Ports |
| Speed (ns) | 20 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $149.33 | $126.70 | $123.99 | $120.37 | $118.56 | $115.84 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
235 (Cypress Reflow Profile)
RoHS Compliant
PB Free
N
Lead/Ball Finish
Ni/Pd/Au, Sn/Pb
Marking
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Product Change Notice (PCN) (9)
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Change of assembly materials for all TQFP packages built in Advance Semiconductor Engg (ASE)-Taiwan
Feb 10, 2016
Add Palladium-Nickel-Gold Lead Finish to SOIC, QSOP, SNC, TQFP, TSOPI, TSOP II, TSSOP and SSOP Packages manufactured at CML.
Product Information Notice (PIN) (3)
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).