CY7C025-35AI | Cypress Semiconductor

CY7C025-35AI
Status: Obsolete

CY7C025-35AI

Automotive QualifiedN
Density (Kb)128
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)8Kb x 16
Speed (ns)35
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$31.00 $25.58 $23.72 $21.70 $20.77 $19.84
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Ni/Pd/Au, Sn/Pb

Technical Documents

Product Change Notice (PCN) (7)

Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 09, 2016
Obsolete Products List for Q3 1999

Product Information Notice (PIN) (1)

Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).

IBIS (1)

Nov 13, 2008