CY62256VNLL-70ZXI | Cypress Semiconductor

CY62256VNLL-70ZXI

Status: In Production

Datasheet

(pdf, 315.34 KB) RoHS PB Free
Datasheet updated: August 24, 2015

CY62256VNLL-70ZXI

Automotive QualifiedN
Density (Kb)256
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)32K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)70
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.19 $2.68 $2.39 $2.10 $1.99 $1.86
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
527 L x 1 H x 314 W (Mils)
Package Weight
247.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
702
Minimum Order Quantity (MOQ)
702
Order Increment
702
Estimated Lead Time (days)
91
HTS Code
8542.32.0040
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (10)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
TSOP Tray Modification (Bottom Pocket Fence)
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 21, 2012