CY62177EV30LL-55BAXIT | Cypress Semiconductor

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CY62177EV30LL-55BAXIT
Status: In Production

Datasheet

(pdf, 341.54 KB) RoHS PB Free

CY62177EV30LL-55BAXIT

Automotive QualifiedN
Density (Kb)32768
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)2M x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$44.59 $36.38 $34.27 $32.15 $31.22 $30.04
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
374 L x 1.2 H x 315 W (Mils)
Package Weight
273.03 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (1)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (5)

Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages

IBIS (1)

May 07, 2011