CY62177EV18LL-70BAXI | Cypress Semiconductor

CY62177EV18LL-70BAXI
Status: In Production

Datasheet

(pdf, 357.55 KB) RoHS PB Free

CY62177EV18LL-70BAXI

Automotive QualifiedN
Density (Kb)32768
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)2.25
Max. Operating Voltage (V)2.25
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.65
Min. Operating Voltage (V)1.65
Organization (X x Y)2M x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)70
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$36.10 $29.78 $27.62 $25.27 $24.19 $23.10
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 1 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
374 L x 1.2 H x 315 W (Mils)
Package Weight
273.03 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
210
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (1)

Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages