CY62177ESL-55ZXIT | Cypress Semiconductor

CY62177ESL-55ZXIT
Status: In Production

Datasheet

(pdf, 482.62 KB) RoHS PB Free

CY62177ESL-55ZXIT

Automotive QualifiedN
Density (Kb)32768
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)x8 / x16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$63.96 $54.09 $51.90 $49.34 $48.25 $46.78
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (6)

Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (6)

Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

White Papers (1)

VHDL (1)

Apr 09, 2012