CY62167DV30LL-70BVIT | Cypress Semiconductor

Status: In Production


(pdf, 327.87 KB)


Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)1M x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)70
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.97 $11.75 $10.48 $9.21 $8.70 $8.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
158.56 (mgs)
Package Cross Section Drawing
Package Carrier
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Oct 12, 2017
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
Oct 12, 2017
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
Feb 10, 2016
Change of wafer thickness from 11mils to 7mils for VFBGA packages assembled in CML Autoline
Feb 08, 2016
Add CML Autoline Philippines as Alternate Assembly Site for FBGA (1.2mm thick ) and VFBGA (1.0mm thick ) Pb-Free packages

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Apr 03, 2012