CY62167DV30LL-55ZXI | Cypress Semiconductor

CY62167DV30LL-55ZXI

Status: In Production

Datasheet

(pdf, 327.87 KB) RoHS PB Free
Datasheet updated: August 17, 2015

CY62167DV30LL-55ZXI

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)x8 / x16
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.81 $15.82 $14.11 $12.40 $11.71 $10.94
Availability Quantity Ships In Order Now
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
192
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
42
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016
Last Update: Sep 15, 2016

Technical Documents

Product Change Notice (PCN) (12)

Feb 10, 2016
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
Feb 10, 2016
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
Feb 10, 2016
Add Alternate Assembly Site for TSOP48 Pb-Free
Feb 10, 2016
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 48 and 56 lead Pb-free TSSOP packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

White Papers (1)

PCN (1)

Sep 30, 2015
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology

IBIS (1)

Apr 03, 2012

VHDL (1)

Apr 02, 2012