CY62167DV30LL-55BVXI | Cypress Semiconductor

CY62167DV30LL-55BVXI
Status: In Production

Datasheet

(pdf, 327.87 KB) RoHS PB Free

CY62167DV30LL-55BVXI

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)1M x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.97 $11.75 $10.48 $9.21 $8.70 $8.13
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 220 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
118.27 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
210
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016
Last Update: Sep 15, 2016

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 18, 2017
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of Cypress Manufacturing Limited as an additional assembly site for 48-FBGA 8X9.5X1.0mm Pb-Free package
Oct 13, 2017
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
Oct 12, 2017
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48 ball 8x9.5mm BGA Packages Using SnAgCu Solder Balls
Oct 12, 2017
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
Oct 12, 2017
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology

Product Information Notice (PIN) (2)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

PCN (1)

Sep 30, 2015
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology

IBIS (1)

Apr 03, 2012