CY62157EV18LL-55BVXI | Cypress Semiconductor

CY62157EV18LL-55BVXI
Status: In Production

Datasheet

(pdf, 211.15 KB) RoHS PB Free

CY62157EV18LL-55BVXI

Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)2.25
Max. Operating Voltage (V)2.25
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.65
Min. Operating Voltage (V)1.65
Organization (X x Y)512K x 16
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.23 $8.60 $7.67 $6.74 $6.37 $5.95
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
77
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (8)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 17, 2017
Qualification of 6x8x1.0 mm 48 FBGA products at Cypress Philippines
Oct 13, 2017
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
Oct 12, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
Oct 11, 2017

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757

White Papers (1)

IBIS (1)

May 30, 2012

VHDL (1)

Sep 02, 2009