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CY62148EV30LL-45ZSXI | Cypress Semiconductor


Status: In Production


(pdf, 2.16 MB) RoHS PB Free
Datasheet updated: April 28, 2016


Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)512K x 8
Speed (ns)45
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.85 $4.08 $3.63 $3.21 $3.02 $2.84
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
820 L x 1 H x 435 W (Mils)
Package Weight
436.42 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish
Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (9)

Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
Feb 08, 2016
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
Feb 08, 2016
TSOP Tray Modification (Bottom Pocket Fence)
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Dec 22, 2015
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
PIN - Unit orientation in carrier tape for TQFP52 and TQFP32 packages in reference to PCN#61194
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

White Papers (1)

Product Termination Notice (PTN) (1)

Feb 05, 2016
Second Errata for Prune/EOL/Obsolete PCN 071503

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009