CY62148ELL-45ZSXI | Cypress Semiconductor

CY62148ELL-45ZSXI

Status: In Production

Datasheet

(pdf, 2.04 MB) RoHS PB Free
Datasheet updated: June 05, 2016

CY62148ELL-45ZSXI

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)512K x 8
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.49 $5.46 $4.87 $4.28 $4.04 $3.78
Availability Quantity Ships In Order Now
In Stock 390 24-48 hours

Packaging/Ordering

Package
No. of Pins
32
Package Dimensions
820 L x 1 H x 435 W (Mils)
Package Weight
436.42 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
234
Minimum Order Quantity (MOQ)
234
Order Increment
234
Estimated Lead Time (days)
42
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (9)

Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-II 400mils Packages
Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free TSOP-I 300mil Packages
Feb 08, 2016
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
Feb 08, 2016
TSOP Tray Modification (Bottom Pocket Fence)
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Dec 22, 2015
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009