CY62137FV18LL-55BVXI | Cypress Semiconductor

CY62137FV18LL-55BVXI

Status: In Production

Datasheet

(pdf, 482.72 KB) RoHS PB Free
Datasheet updated: August 24, 2015

CY62137FV18LL-55BVXI

Automotive QualifiedN
Density (Kb)2048
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)2.25
Max. Operating Voltage (V)2.25
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)1.65
Min. Operating Voltage (V)1.65
Organization (X x Y)128K x 16
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.62 $3.89 $3.47 $3.05 $2.88 $2.69
Availability Quantity Ships In Order Now
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
28
HTS Code
8542.32.0040
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (5)

Feb 10, 2016
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Sep 16, 2011

VHDL (1)

Sep 02, 2009