CY62128EV30LL-45ZXI | Cypress Semiconductor

CY62128EV30LL-45ZXI
Status: In Production

Datasheet

(pdf, 890.13 KB) RoHS PB Free

CY62128EV30LL-45ZXI

Automotive QualifiedN
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)128K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.99 $2.52 $2.24 $1.97 $1.89 $1.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 410 24-48 hours

Packaging/Ordering

Package
No. of Pins
32
Package Dimensions
315 L x 1 H x 787 W (Mils)
Package Weight
375.63 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
780
Minimum Order Quantity (MOQ)
780
Order Increment
780
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (9)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 24, 2017
TSOP Tray Modification (Bottom Pocket Fence)
Oct 15, 2017
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 32 lead TSOP 8x20mm Pb-Free package
Oct 12, 2017
Correction to PCN#071512: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (2)

Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Sep 24, 2009

VHDL (1)

Sep 02, 2009