CY26049ZXI-36 | Cypress Semiconductor


Status: In Production



Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)60
Input Frequency Min. (MHz)0.008
Input Signal TypeLVCMOS/LVTTL
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.15
No. of Outputs3
No. of PLL1
Output Frequency Max. (MHz)155.52
Output Frequency Min. (MHz)0.008
Output Signal TypeLVCMOS
Spread SpectrumN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$31.90 $26.32 $24.40 $22.33 $21.37 $20.42
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish
Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (14)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the FailSafe Clock Product Family
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

Product Termination Notice (PTN) (1)

Feb 05, 2016
Product Obsolescence Notification

IBIS (1)

Mar 16, 2012