CY25823ZXC | Cypress Semiconductor

CY25823ZXC
Status: In Production

Datasheet

(pdf, 1.68 MB) RoHS PB Free

CY25823ZXC

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)14.13
Input Frequency Min. (MHz)14.13
Input Signal TypeRef-in CMOS
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.13
No. of Outputs2
No. of PLL1
Output Frequency Max. (MHz)100
Output Frequency Min. (MHz)96
Output Signal TypeCMOS and Differential
Spread SpectrumY
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.27 $1.91 $1.70 $1.49 $1.41 $1.32
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
480
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
91
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Technical Documents

Product Change Notice (PCN) (15)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Lead (Pb)- Free Marketing Part Number Definition
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

IBIS (1)

Feb 04, 2010